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features description applications tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 current-limited, power-distribution switches output discharge function 70-m w high-side mosfet 1-a continuous current thermal and short-circuit protection accurate current limit (1.1 a min, 1.9 a max) operating range: 2.7 v to 5.5 v the tps206x-1 power-distribution switches are 0.6-ms typical rise time intended for applications where heavy capacitive undervoltage lockout loads and short-circuits are likely to be encountered. deglitched fault report ( oc) this device incorporates 70-m w n-channel mosfet power switches for power-distribution systems that no oc glitch during power up require multiple power switches in a single package. 1-a maximum standby supply current each switch is controlled by a logic enable input. ambient temperature range: -40 c to 85 c gate drive is provided by an internal charge pump designed to control the power-switch rise times and esd protection fall times to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as heavy capacitive loads low as 2.7 v. short-circuit protections these switches provide a discharge function that provides a controlled discharge of the output voltage stored on the output capacitor. when the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent ( ocx) logic output low. when continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. recovery from a thermal shutdown is automatic once the device has cooled sufficiently. internal circuitry ensures that the switch remains off until valid input voltage is present. this power-distribution switch is designed to set current limit at 1.5 a typically. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. unless otherwise noted this document contains copyright ? 2007, texas instruments incorporated production data information current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www.ti.com tps2065-1 dgn package (top view) tps2062/tps2066 d and dgn package (top view) tps201xatps202x tps203x 33 m w , single 0.2 a ? 2 a 0.2 a ? 2 a0.2 a ? 2 a tps2014tps2015 tps2041b tps2051b tps2045 tps2055 tps2061 tps2065 80 m w , single 600 ma1 a 500 ma 500 ma 250 ma 250 ma 1 a 1 a general switch ca talog tps2042btps2052b tps2046 tps2056 tps2062 tps2066 tps2060 tps2064 80 m w , dual 500 ma 500 ma250 ma 250 ma 1 a 1 a 1.5 a 1.5 a tps2100/1 260 m w in1 500 main2 10 ma out in1in2 tps2102/3/4/5 in1 500 main2 100 ma 1.3 w tps2043btps2053b tps2047 tps2057 80 m w , triple 500 ma500 ma 250 ma 250 ma tps2044btps2054b tps2048 tps2058 80 m w , quad 500 ma500 ma 250 ma 250 ma 80 m w , dual tps2080tps2081 tps2082 tps2090 500 ma500 ma 500 ma 250 ma tps2091tps2092 250 ma250 ma 80 m w , quad tps2085tps2086 tps2087 tps2095 500 ma500 ma 500 ma 250 ma tps2096tps2097 250 ma250 ma d?8 dgn?8 d?16
absolute maximum ratings tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. available option and ordering information (1) recommended typical packaged maximum short-circuit number of devices (2) t a enable continuous current limit switches msop (dgn) soic(d) load current at 25 c active high single tps2065dgn-1 ?40 c to 85 c active low 1 a 1.5 a tps2062d-1 dual active high tps2066dgn-1 (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti website at www.ti.com . (2) the package is available taped and reeled. add an r suffix to device types (e.g., tps2062-1dr). ordering information t a soic(d) status msop (dgn) status tps2062d active active ?40 c to 85 c active tps2065dgn active active tps2066dgn active over operating free-air temperature range unless otherwise noted (1) unit input voltage range, v i(in) (2) ?0.3 v to 6 v output voltage range, v o(out) (2) , v o(outx) -0.3 v to 6 v input voltage range, v i( en) , v i(en) , v i( enx) , v i(enx) ?0.3 v to 6 v voltage range, v i( oc) , v i( ocx) ?0.3 v to 6 v continuous output current, i o(out) , i o(outx) internally limited continuous total power dissipation see dissipation rating table operating virtual junction temperature range, t j -40 c to 125 c storage temperature range, t stg ?65 c to 150 c human body model mil-std-883c 2 kv electrostatic discharge (esd) protection charge device model (cdm) 500 v (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltages are with respect to gnd. 2 submit documentation feedback www.ti.com
dissipating rating table recommended operating conditions electrical characteristics tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 t a 25 c derating factor t a = 70 c t a = 85 c package power rating above t a = 25 c power rating power rating d-8 585.82 mw 5.8582 mw/ c 322.20 mw 234.32 mw dgn-8 1712.3 mw 17.123 mw/ c 941.78 mw 684.33 mw min max unit input voltage, v i(in) 2.7 5.5 v input voltage, v i( en) , v i(en) , v i( enx) , v i(enx) 0 5.5 v continuous output current, i o(out) , i o(outx) 0 1 a steady state current through discharge. device disabled, measured through output pin(s) 8 ma operating virtual junction temperature, t j -40 125 c over recommended operating junction temperature range, v i(in) = 5.5 v, i o = 1 a, v i(/enx) = 0 v, or v i(enx) = 5.5 v (unless otherwise noted) parameter test conditions (1) min typ max unit power switch static drain-source on-state resistance, v i(in) = 5 v or 3.3 v, i o = 1 a, ?40 c t j 125 c 70 135 m w 5-v operation and 3.3-v operation r ds(on) static drain-source on-state resistance, v i(in) = 2.7 v, i o = 1 a, -40 c t j 125c 75 150 m w 2.7-v operation (2) v i(in) = 5.5 v 0.6 1.5 t r (2) rise time, output v i(in) = 2.7 v 0.4 1 c l = 1 m f, r l = 5 w , t j = 25 c ms v i(in) = 5.5 v 0.05 0.5 t f (2) fall time, output v i(in) = 2.7 v 0.05 0.5 enable input en or en v ih high-level input voltage 2.7 v v i(in) 5.5 v 2 v v il low-level input voltage 2.7 v v i(in) 5.5 v 0.8 i i input current v i( enx) = 0 v or 5.5 v, v i(enx) = 0 v or 5.5 v -0.5 0.5 m a t on (3) turnon time c l = 100 m f, r l = 5 w 3 ms t off (3) turnoff time c l = 100 m f, r l = 5 w 10 current limit t j = 25 c 1.1 1.5 1.9 v i(in) = 5 v, out connected to gnd, i os short-circuit output current a device enabled into short-circuit -40 c t j 125 c 1.1 1.5 2.1 i oc_trip (3) overcurrent trip threshold v i(in) = 5 v, current ramp ( 100 a/s) on out 2.4 3 a supply current (tps2065-1) t j = 25 c 0.5 1 no load on out, v i( enx) = 5.5 v, supply current, low-level output m a or v i(enx) = 0 v -40 c t j 125 c 0.5 10 t j = 25 c 43 60 no load on out, v i( enx) = 0 v, supply current, high-level output m a or v i(enx) = 5.5 v -40 c t j 125 c 43 70 reverse leakage current v i(outx) = 5.5 v, in = ground (3) t j = 25 c 0 m a supply current (tps2062-1, tps2066-1) t j = 25 c 0.5 1 no load on out, v i( enx) = 5.5 v, supply current, low-level output m a or v i(enx) = 0 v -40 c t j 125 c 0.5 20 t j = 25 c 50 70 no load on out, v i( enx) = 0 v, supply current, high-level output m a or v i(enx) = 5.5 v -40 c t j 125 c 50 90 reverse leakage current v i(outx) = 5.5 v, in = ground (3) t j = 25 c 0.2 m a (1) pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. (2) not tested in production, specified by design. (3) not tested in production, specified by design. 3 submit documentation feedback www.ti.com
device information tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 electrical characteristics (continued) over recommended operating junction temperature range, v i(in) = 5.5 v, i o = 1 a, v i(/enx) = 0 v, or v i(enx) = 5.5 v (unless otherwise noted) parameter test conditions (1) min typ max unit undervoltage lockout low-level input voltage, in 2 2.5 v hysteresis, in t j = 25 c 75 mv overcurrent oc1 and oc2 output low voltage, v ol(ocx) i o( ocx) = 5 ma 0.4 v off-state current (3) v o( ocx) = 5 v or 3.3 v 1 m a oc deglitch (3) ocx assertion or deassertion 4 8 15 ms discharge resistance v cc = 5 v, disabled, i o = 1 ma 100 w thermal shutdown (4) thermal shutdown threshold (3) 135 c recovery from thermal shutdown (3) 125 c hysteresis (3) 10 c (4) the thermal shutdown only reacts under overcurrent conditions. terminal functions terminal i/o description tps2065-1, name tps2062-1 tps2066-1 en 4 - i enable input, logic low turns on power switch en - 4 i enable input, logic high turns on power switch gnd 1 1 ground in 2, 3 2, 3 i input voltage oc 5 5 o overcurrent, open-drain output, active-low out 6, 7, 8 6, 7, 8 o power-switch output functional block diagram (tps2065-1) 4 submit documentation feedback www.ti.com outoc in en gnd current limit driver uvlo charge pump cs thermal sense deglitch note a: current sense (see note a) en discharge control
tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 terminal functions terminal no. i/o description name tps2065-1, tps2062-1 tps2066-1 en1 3 ? i enable input, logic low turns on power switch in-out1 en2 4 ? i enable input, logic low turns on power switch in-out2 en1 ? 3 i enable input, logic high turns on power switch in-out1 en2 ? 4 i enable input, logic high turns on power switch in-out2 gnd 1 1 ground in 2 2 i input voltage oc1 8 8 o overcurrent, open-drain output, active low, in-out1 oc2 5 5 o overcurrent, open-drain output, active low, in-out2 out1 7 7 o power-switch output, in-out1 out2 6 6 o power-switch output, in-out2 functional block diagram (tps2062-1 and tps2066-1) 5 submit documentation feedback www.ti.com thermal sense driver current limit charge pump uvlo cs driver current limit cs thermal sense charge pump gnd en1 in en2 oc1 out1 out2oc2 deglitch deglitch (see note a) (see note a) (see note b) (see note b) note a: current sense note b: active low ( ) for tps2062. active high ( ) for tps2066 enx enx en discharge control en discharge control
parameter measurement information tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 figure 1. test circuit and voltage waveforms figure 2. turnon delay and rise time with 1-f load figure 3. turnoff delay and fall time with 1-f load 6 submit documentation feedback www.ti.com r l c l out t r t f 90% 90% 10% 10% 50% 50% 90% 10% v o(out) v i(en) v o(out) volt age w aveforms test circuit t on t off 50% 50% 90% 10% v i(en) v o(out) t on t off v i(en) 5 v/div v o(out) 2 v/div r l = 5 , c l = 1 f t a = 25 c t ? t ime ? 500 s/div v i(en) 5 v/div v o(out) 2 v/div r l = 5 , c l = 1 f t a = 25 c t ? t ime ? 500 s/div
tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 parameter measurement information (continued) figure 4. turnon delay and rise time with 100-f load figure 5. turnoff delay and fall time with 100-f load figure 6. short-circuit current, figure 7. inrush current with different device enabled into short load capacitance 7 submit documentation feedback www.ti.com v i(en) 5 v/div i o(out) 500 ma/div t ? t ime ? 500 s/div v i(en) 5 v/div i o(out) 500 ma/div 470 f 100 f 220 f v in = 5 v r l = 5 , t a = 25 c t ? t ime ? 1 ms/div v i(en) 5 v/div v o(out) 2 v/div r l = 5 , c l = 100 f t a = 25 c t ? t ime ? 500 s/div v o(out) 2 v/div v i(en) 5 v/div r l = 5 , c l = 100 f t a = 25 c t ? t ime ? 500 s/div
tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 parameter measurement information (continued) figure 8. 2- w load connected to enabled device figure 9. 1- w load connected to enabled device 8 submit documentation feedback www.ti.com v o(oc ) 2 v/div i o(out) 1 a/div t ? t ime ? 2 ms/div v o(oc ) 2 v/div i o(out) 1 a/div t ? t ime ? 2 ms/div
typical characteristics tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 turnon time turnoff time vs vs input voltage input voltage figure 10. figure 11. rise time fall time vs vs input voltage input voltage figure 12. figure 13. 9 submit documentation feedback www.ti.com 0 0.1 0.2 0.3 0.4 0.5 0.6 2 3 4 5 6 rise t ime ? ms v i ? input v oltage ? v c l = 1 f, r l = 5 , t a = 25 c 0 0.05 0.1 0.15 0.2 0.25 2 3 4 5 6 c l = 1 f, r l = 5 , t a = 25 c fall t ime ? ms v i ? input v oltage ? v 1.5 1.6 1.7 1.8 1.9 2 2 3 4 5 6 c l = 100 f, r l = 5 , t a = 25 c t urnoff t ime ? ms v i ? input v oltage ? v 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2 3 4 5 6 t urnon t ime ? ms v i ? input v oltage ? v c l = 100 f, r l = 5 , t a = 25 c
tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 typical characteristics (continued) tps2061, tps2065-1 tps2062-1, tps2066-1 supply current, output enabled supply current, output enabled vs vs junction temperature junction temperature figure 14. figure 15. tps2065-1 tps2062-1, tps2066-1 supply current, output disabled supply current, output disabled vs vs junction temperature junction temperature figure 16. figure 17. 10 submit documentation feedback www.ti.com 0 10 20 30 40 50 60 ?50 0 50 100 150 v i = 5.5 v v i = 3.3 v v i = 2.7 v t j ? junction t emperature ? c ? supply current, output enabled ? i i (in) a m v i = 5 v 0 10 20 30 40 50 60 70 ?50 0 50 100 150 v i = 5.5 v v i = 5 v v i = 3.3 v v i = 2.7 v t j ? junction t emperature ? c ? supply current, output enabled ? i i (in) a m t ? junction t j emperature ? c o i ? off-state current ? a m 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 ?50 0 50 100 150 t ? junction t j emperature ? c o i ? off-state current ? a m 0 1 2 3 4 5 6 7 10 ?50 0 50 100 150 8 9
tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 typical characteristics (continued) static drain-source on-state resistance short-circuit output current vs vs junction temperature junction temperature figure 18. figure 19. threshold trip current undervoltage lockout vs vs input voltage junction temperature figure 20. figure 21. 11 submit documentation feedback www.ti.com 1.34 1.36 1.38 1.4 1.42 1.44 1.48 1.5 1.52 1.54 1.56 ?50 0 50 100 150 1.46 v i = 3.3 v v i = 5 v v i = 3.3 v v i = 5.5 v t j ? junction t emperature ? c ? short-circuit output current ? a i os v i = 2.7 v 0 20 40 60 80 100 120 ?50 0 50 100 150 out1 = 5 v out1 = 3.3 v out1 = 2.7 v i o = 0.5 a t j ? junction t emperature ? c r ds(on) ? static drain-source on-state resistance ? m w 2.1 2.14 2.18 2.22 2.26 2.3 ?50 0 50 100 150 uvlo rising uvlo falling uvol ? undervoltage lockout ? v t j ? junction t emperature ? c 1.5 1.7 1.9 2.1 2.3 2.5 2.5 3 3.5 4 4.5 5 5.5 6 t a = 25 c load ramp = 1a/10 ms threshold t rip current ? a v i ? input v oltage ? v
tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 typical characteristics (continued) current-limit response vs peak current figure 22. 12 submit documentation feedback www.ti.com 0 50 100 150 200 0 2.5 5 7.5 10 12.5 current-limit response ? s m peak current ? a v i = 5 v , t a = 25 c
application information power-supply considerations overcurrent oc response tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 figure 23. typical application a 0.01- m f to 0.1- m f ceramic bypass capacitor between in and gnd, close to the device, is recommended. placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy. this precaution reduces power-supply transients that may cause ringing on the input. additionally, bypassing the output with a 0.01- m f to 0.1- m f ceramic capacitor improves the immunity of the device to short-circuit transients. a sense fet is employed to check for overcurrent conditions. unlike current-sense resistors, sense fets do not increase the series resistance of the current path. when an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. complete shutdown occurs only if the fault is present long enough to activate thermal limiting. three possible overload conditions can occur. in the first condition, the output has been shorted before the device is enabled or before v i(in) has been applied (see figure 15 ). the tps206x-1 senses the short and immediately switches into a constant-current output. in the second condition, a short or an overload occurs while the device is enabled. at the instant the overload occurs, high currents may flow for a short period of time before the current-limit circuit can react. after the current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into constant-current mode. in the third condition, the load has been gradually increased beyond the recommended operating current. the current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is exceeded (see figure 17 ). the tps206x-1 is capable of delivering current up to the current-limit threshold without damaging the device. once the threshold has been reached, the device switches into its constant-current mode. the ocx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition is encountered after a 10-ms deglitch timeout. the output remains asserted until the overcurrent or overtemperature condition is removed. connecting a heavy capacitive load to an enabled device can cause a momentary overcurrent condition; however, no false reporting on ocx occurs due to the 10-ms deglitch circuit. the tps206x-1 is designed to eliminate false overcurrent reporting. the internal overcurrent deglitch eliminates the need for external components to remove unwanted pulses. ocx is not deglitched when the switch is turned off due to an overtemperature shutdown. 13 submit documentation feedback www.ti.com inoc1 en1 oc2 2 85 7 0.1 f 22 f 0.1 f 22 f load load out1out2 power supply 2.7 v to 5.5 v 6 en2 34 gnd 0.1 f tps2062-1 1
power dissipation and junction temperature thermal protection undervoltage lockout (uvlo) tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 application information (continued) figure 24. typical circuit for the oc pin the low on-resistance on the n-channel mosfet allows the small surface-mount packages to pass large currents. the thermal resistances of these packages are high compared to those of power packages; it is good design practice to check power dissipation and junction temperature. begin by determining the r ds(on) of the n-channel mosfet relative to the input voltage and operating temperature. as an initial estimate, use the highest operating ambient temperature of interest and read r ds(on) from figure 18 . using this value, the power dissipation per switch can be calculated by: p d = r ds(on) i 2 multiply this number by the number of switches being used. this step renders the total power dissipation from the n-channel mosfets. finally, calculate the junction temperature: t j = p d r q ja + t a where: t a = ambient temperature c r q ja = thermal resistance p d = total power dissipation based on number of switches being used. compare the calculated junction temperature with the initial estimate. if they do not agree within a few degrees, repeat the calculation, using the calculated value as the new estimate. two or three iterations are generally sufficient to get a reasonable answer. thermal protection prevents damage to the ic when heavy-overload or short-circuit faults are present for extended periods of time. the tps206x-1 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. in an overcurrent or short-circuit condition, the junction temperature rises due to excessive power dissipation. once the die temperature rises to approximately 140 c due to overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. hysteresis is built into the thermal sense circuit, and after the device has cooled approximately 10 c, the switch turns back on. the switch continues to cycle in this manner until the load fault or input power is removed. the ocx open-drain output is asserted (active low) when an overtemperature shutdown or overcurrent occurs. an undervoltage lockout ensures that the power switch is in the off state at power up. whenever the input voltage falls below approximately 2 v, the power switch is quickly turned off. this facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. the uvlo also keeps the switch from being turned on until the power supply has reached at least 2 v, even if the switch is enabled. on reinsertion, the power switch is turned on, with a controlled rise time to reduce emi and voltage overshoots. 14 submit documentation feedback www.ti.com gndin en1 en2 oc1 oc2 out1out2 tps2062-1 r pullup v+
universal serial bus (usb) applications host/self-powered and bus-powered hubs tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 application information (continued) the universal serial bus (usb) interface is a 12-mb/s, or 1.5-mb/s, multiplexed serial bus designed for low-to-medium bandwidth pc peripherals (e.g., keyboards, printers, scanners, and mice). the four-wire usb interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. two lines are provided for differential data, and two lines are provided for 5-v power distribution. usb data is a 3.3-v level signal, but power is distributed at 5 v to allow for voltage drops in cases where power is distributed through more than one hub across long cables. each function must provide its own regulated 3.3 v from the 5-v input or its own internal power supply. the usb specification defines the following five classes of devices, each differentiated by power-consumption requirements: hosts/self-powered hubs (sph) bus-powered hubs (bph) low-power, bus-powered functions high-power, bus-powered functions self-powered functions sphs and bphs distribute data and power to downstream functions. the tps206x-1 has higher current capability than required by one usb port; so, it can be used on the host side and supplies power to multiple downstream ports or functions. hosts and sphs have a local power supply that powers the embedded functions and the downstream ports (see figure 25 ). this power supply must provide from 5.25 v to 4.75 v to the board side of the downstream connection under full-load and no-load conditions. hosts and sphs are required to have current-limit protection and must report overcurrent conditions to the usb controller. typical sphs are desktop pcs, monitors, printers, and stand-alone hubs. 15 submit documentation feedback www.ti.com
low-power bus-powered and high-power bus-powered functions tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 application information (continued) figure 25. typical four-port usb host / self-powered hub bphs obtain all power from upstream ports and often contain an embedded function. the hubs are required to power up with less than one unit load. the bph usually has one embedded function, and power is always available to the controller of the hub. if the embedded function and hub require more than 100 ma on power up, the power to the embedded function may need to be kept off until enumeration is completed. this can be accomplished by removing power or by shutting off the clock to the embedded function. power switching the embedded function is not necessary if the aggregate power draw for the function and controller is less than one unit load. the total current drawn by the bus-powered device is the sum of the current to the controller, the embedded function, and the downstream ports, and it is limited to 500 ma from an upstream port. both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power functions always draw less than 100 ma; high-power functions must draw less than 100 ma at power up and can draw up to 500 ma after enumeration. if the load of the function is more than the parallel combination of 44 w and 10 f at power up, the device must implement inrush current limiting (see figure 26 ). with tps206x-1, the internal functions could draw more than 500 ma, which fits the needs of some applications such as motor driving circuits. 16 submit documentation feedback www.ti.com inoc1 en1 oc2 en2 gnd 0.1 f 28 3 5 4 7 33 f 33 f gnd 1 out1 tps2062-1 power supply d+ d? v bus gnd d+ d? v bus downstream usb ports usb controller 3.3 v 5 v 33 f gnd out2 d+ d? v bus 33 f gnd d+ d? v bus 6 0.1 f 0.1 f 0.1 f 0.1 f
usb power-distribution requirements tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 application information (continued) figure 26. high-power bus-powered function usb can be implemented in several ways, and, regardless of the type of usb device being developed, several power-distribution features must be implemented. hosts/sphs must: ? current-limit downstream ports ? report overcurrent conditions on usb v bus bphs must: ? enable/disable power to downstream ports ? power up at <100 ma ? limit inrush current (<44 w and 10 m f) functions must: ? limit inrush currents ? power up at <100 ma the feature set of the tps206x-1 allows them to meet each of these requirements. the integrated current-limiting and overcurrent reporting is required by hosts and self-powered hubs. the logic-level enable and controlled rise times meet the need of both input and output ports on bus-powered hubs, as well as the input ports for bus-powered functions (see figure 27 ). 17 submit documentation feedback www.ti.com inoc1 oc2 2 83 5 4 7 0.1 f 10 f internal function out1 power supply 3.3 v en1 6 0.1 f 10 f out2 internal function 0.1 f 10 f usb control gnd v bus d? d+ tps2062-1 en2 gnd 1
generic hot-plug applications tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 application information (continued) figure 27. hybrid self / bus-powered hub implementation in many applications it may be necessary to remove modules or pc boards while the main unit is still operating. these are considered hot-plug applications. such implementations require the control of current surges seen by the main power supply and the card being inserted. the most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. due to the controlled rise times and fall times of the tps206x-1, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. the uvlo feature of the tps206x-1 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. the uvlo feature insures a soft start with a controlled rise time for every insertion of the card or module. 18 submit documentation feedback www.ti.com dp1 dm1 dp2 dm2 dp3 dm3 dp4 pwron1 ovrcur1 pwron2 ovrcur2 dm4 dp0dm0 v cc xtal1 xtal2 ocsoff sn75240 d + d ? 5 v gnd d + d ? 5 v d + d ? 5 v d + d ? 5 v 48-mhz crystal downstream ports tusb2040 hub controller tuning circuit ab cd 33 f ? sn75240 ab cd gnd gnd gnd 33 f ? 33 f ? 33 f ? d + d ? upstreamport tps2041b sn75240 a b 5 v gnd cd 1 f in gnd ferrite beads ferrite beads ferrite beads ferrite beads buspwr ganged tie to tps2041 en input oc en out 5-v power supply ingnd 3.3 v 4.7 f 0.1 f 4.7 f en1 in oc1 out1 tps2062-1 en2 oc2 out2 0.1 f gnd note: usb rev 1.1 requires 120 m f per hub. tps76333
detailed description power switch charge pump driver enable ( enx or enx) overcurrent ( ocx) tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 application information (continued) figure 28. typical hot-plug implementation by placing the tps206x-1 between the v cc input and the rest of the circuitry, the input power reaches these devices first after insertion. the typical rise time of the switch is approximately 1 ms, providing a slow voltage ramp at the output of the device. this implementation controls system surge currents and provides a hot-plugging mechanism for any device. the power switch is an n-channel mosfet with a low on-state resistance. configured as a high-side switch, the power switch prevents current flow from out to in and in to out when disabled. the power switch supplies a minimum current of 1 a. an internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate of the mosfet above the source. the charge pump operates from input voltages as low as 2.7 v and requires little supply current. the driver controls the gate voltage of the power switch. to limit large current surges and reduce the associated electromagnetic interference (emi) produced, the driver incorporates circuitry that controls the rise times and fall times of the output voltage. the logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to reduce the supply current. the supply current is reduced to less than 1 m a when a logic high is present on enx, or when a logic low is present on enx. a logic zero input on enx, or a logic high input on enx restores bias to the drive and control circuits and turns the switch on. the enable input is compatible with both ttl and cmos logic levels. the ocx open-drain output is asserted (active low) when an overcurrent or overtemperature condition is encountered. the output remains asserted until the overcurrent or overtemperature condition is removed. a 10-ms deglitch circuit prevents the ocx signal from oscillation or false triggering. if an overtemperature shutdown occurs, the ocx is asserted instantaneously. 19 submit documentation feedback www.ti.com power supply 0.1 f 1000 f optimum 2.7 v to 5.5 v pc board overcurrent response tps2062-1 oc1 gnd en1 in en2 out1 out2 oc2 block ofcircuitry block ofcircuitry
current sense thermal sense undervoltage lockout discharge function tps2062-1 tps2065-1 tps2066-1 slvs714 ? february 2007 detailed description (continued) a sense fet monitors the current supplied to the load. the sense fet measures current more efficiently than conventional resistance methods. when an overload or short circuit is encountered, the current-sense circuitry sends a control signal to the driver. the driver in turn reduces the gate voltage and drives the power fet into its saturation region, which switches the output into a constant-current mode and holds the current constant while varying the voltage on the load. the tps206x-1 implements a thermal sensing to monitor the operating temperature of the power distribution switch. in an overcurrent or short-circuit condition the junction temperature rises. when the die temperature rises to approximately 140 c due to overcurrent conditions, the internal thermal sense circuitry turns off the switch, thus preventing the device from damage. hysteresis is built into the thermal sense, and after the device has cooled approximately 10 degrees, the switch turns back on. the switch continues to cycle off and on until the fault is removed. the open-drain false reporting output ( ocx) is asserted (active low) when an overtemperature shutdown or overcurrent occurs. a voltage sense circuit monitors the input voltage. when the input voltage is below approximately 2 v, a control signal turns off the power switch. when the device is disabled (when enable is deasserted or during power-up power-down when v i < uvlo) the discharge function is active. the discharge function offers a resistive discharge path for the external storage capacitor. this is suitable only to discharge filter capacitors for limited time and cannot dissipate steady state currents greater than 8 ma. 20 submit documentation feedback www.ti.com
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) tps2062d-1 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tps2062d-1g4 active soic d 8 75 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tps2062dr-1 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tps2062dr-1g4 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim tps2065dgn-1 active msop- power pad dgn 8 80 green (rohs & no sb/br) cu nipdau level-2-260c-1 year tps2065dgn-1g4 active msop- power pad dgn 8 80 green (rohs & no sb/br) cu nipdau level-2-260c-1 year tps2065dgnr-1 active msop- power pad dgn 8 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year TPS2065DGNR-1G4 active msop- power pad dgn 8 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year tps2066dgn-1 active msop- power pad dgn 8 80 tbd call ti call ti tps2066dgnr-1 active msop- power pad dgn 8 2500 tbd call ti call ti (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited package option addendum www.ti.com 7-may-2007 addendum-page 1
information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 7-may-2007 addendum-page 2
tape and reel information package materials information www.ti.com 17-may-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tps2062dr-1 d 8 fmx 330 0 6.4 5.2 2.1 8 12 pkgorn t1tr-ms p tps2065dgnr-1 dgn 8 nse 330 12 5.3 3.3 1.3 8 12 pkgorn t1tr-ms p tape and reel box information device package pins site length (mm) width (mm) height (mm) tps2062dr-1 d 8 fmx 342.9 336.6 20.6 tps2065dgnr-1 dgn 8 nse 370.0 355.0 55.0 package materials information www.ti.com 17-may-2007 pack materials-page 2
package materials information www.ti.com 17-may-2007 pack materials-page 3

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